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Circuit Board Rework Equipment - List of Manufacturers, Suppliers, Companies and Products

Circuit Board Rework Equipment Product List

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[Information] Introduction to IR Method BGA Rework System

[Information] Introduction to IR Method BGA Rework System

Detailed information about the BGA rework system with a global cumulative sales volume of 7,000 units.

This is an introduction document for the IR method BGA rework systems "IR550A" and "IR/PL650A" owned by Viola Corporation. It covers issues related to lead-free rework using hot air, comparisons between hot air methods and ERSA IR heaters during BGA rework, and various advantages of infrared heating. [Contents (excerpt)] ■ ERSA IR/PL IR Rework Station ■ Issues with lead-free rework using hot air ■ Comparison of hot air methods and ERSA IR heaters during BGA rework ■ Advanced technology from ERSA ■ RPC Reflow Observation Camera ■ Various advantages of infrared heating, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract
  • Other contract services

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BGA/SMT Rework Machine "RD-500III"

BGA/SMT Rework Machine "RD-500III"

[Parts Repair/Repair/Reimplementation] Stable and safe rework operations, standard solder and lead-free solder, compatible with large and small circuit boards, large and small devices!

The "RD-500III" is a rework system that supports stable and safe rework operations, lead-free solder, eutectic solder, large substrates (up to 500×600mm), and various devices. The top heater and bottom heater utilize high-performance, high-efficiency high-power hot air heaters, ensuring stable and safe heating of the joints. 【Features】 ■ Flash memory controller → Does not require moving parts such as hard disks or cooling fans ■ Three heating systems optimal for lead-free applications ■ Two cooling modes tailored to the application ■ Two-point auto profile for device temperature control ■ Integrated functions from solder printing to device setting 【Applications】 - Tablets - Computer motherboards - Mobile phones - Smartphones - Wearables - BGA, CSP, POP, QFN, etc. *For more details, please request materials or view the PDF data available for download.

  • Other semiconductor manufacturing equipment
  • Other processing machines
  • Soldering Equipment

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[Presentation of Materials!] Viola Corporation Introduction to Rework and Reballing

[Presentation of Materials!] Viola Corporation Introduction to Rework and Reballing

Introduction to BGA Rework and Reballing! We are sharing our expertise with over 30,000 rework cases of BGA with a pitch of 0.4 to 0.8mm!

In this document, we introduce the functions of rework and reballing equipment, including BGA rework and reballing. Our company offers BGA replacement, BGA repair, BGA rework, BGA reballing, circuit board modification, circuit board repair, soldering services, and X-ray inspection services with CT functionality. Details of our "BGA Rework and Reballing" include over 30,000 rework achievements for BGA with a pitch of 0.4 to 0.8mm, as well as over 20,000 reballing achievements for BGA with ball diameters ranging from Φ0.2 to 0.8mm. We can also accommodate copper core balls. We can handle requests starting from one piece, and we are capable of working on circuit boards with underfill applied, as well as replacement work for QFN and connectors. Prices are clearly stated, so please feel free to contact us. [Contents] ■ What is rework? ■ What is reballing? ■ The technical capabilities of Viola that meet diverse needs ■ Introduction to some functions of Viola's rework and reballing equipment *For more details, please refer to the PDF document or feel free to contact us.

  • Company：ビオラ
  • Price：Less than 10,000 yen
  • Circuit board design and manufacturing
  • Contract manufacturing
  • Contract Inspection

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Technical Document on the Rework System "Challenges of Reworking Ultra-Small Components (0402)"

Technical Document on the Rework System "Challenges of Reworking Ultra-Small Components (0402)"

Rework Equipment/Rework System [Technical Document] Explanation of Rework Troubles for 0402/0603 Components Used in Wearable and Mobile Devices.

For rework equipment/rework systems, turn to Denon Equipment. Our company offers a wide range of rework systems that cater to everything from large industrial boards to small boards and 0402/0603 components. We are currently offering a technical document titled "Challenges in Reworking Ultra-Small Components (0402/0603)." This document introduces common troubles encountered in reworking 0402 components and solutions provided by our rework system "RD-500V/SV." [Contents] ■ About 0402 components ■ Effectiveness evaluation of adjacent components based on heating methods ■ Contact heating method that minimizes temperature on surrounding components [Component Repair/Repair/Reinstallation] Accepted. [Applications] - Tablets - Computer boards - Mobile phones - Smartphones - Wearables - BGA, CSP, POP, QFN, and more. For more details, please refer to our catalog or feel free to contact us.

  • Circuit board processing machine
  • Other processing machines

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Infrastructure large board compatible rework device MS9000XL

Infrastructure large board compatible rework device MS9000XL

【Support for Large Multi-Layer Weight Boards】 This is a rework device with a proven track record for large boards used in servers and base stations aimed at the next generation Beyond 5G.

Based on the matured mechanisms developed in the current model MS9000SE, we are introducing the new Quattro Views, which will accommodate larger and multi-layered substrates as well as large components. 1. Support for large multi-layer substrates and large components - Supported substrate size and weight: from 400x500mm, maximum 5kg to 650x700mm, maximum 10kg - Supported component size: from maximum 50mm square to 150mm square 2. New introduction of Quattro Views functionality - When mounting and removing large components, the screen for aligning the substrate pattern with the bump positions of the components now allows for easy verification by enlarging and displaying the four corners of the component on a single screen (four-split screen). 3. Even more user-friendly - The child positioning alignment function (Visual Move) realized in the MS9000SE will remain, and we plan to incorporate an evolved and advanced automatic pattern matching function in the future. We will gradually expand and develop the system to achieve an automatic rework system in the future.

  • Other mounting machines

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